Teramount raises $50M to address growing demand for AI infrastructure optical connectivity

Jerusalem, Israel, July 29, 2025 (GLOBE NEWSWIRE) -- Teramount, the leader in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.AI is driving exponential infrastructure growth, pushing the limits of data movement speed and efficiency. To meet these escalating performance and power demands, the industry must adopt advanced optical interconnects to pass data between compute and networking components. Teramount makes this possible with their TeraVerse™ solution: a detachable, serviceable connector that links optical fibers coming from outside the rack to the silicon photonics chips inside Co-Packaged Optics (CPO) systems.

The confidence in Teramount demonstrated by this round is a result of two factors:

Teramount is rapidly emerging as the de facto industry standard for optical fiber to silicon interconnect solutions, partnering with leading ...