Multibeam Secures $31 Million in Series B Financing to Accelerate Global Deployment of E-Beam Lithography Production Solutions

SANTA CLARA, Calif., July 29, 2025 (GLOBE NEWSWIRE) -- Multibeam Corp. today announced that it has raised $31 million in Series B funds from global investors led by Onto Innovation Inc. (NYSE:ONTO), a leader in process control solutions for advanced nodes and advanced packaging, and Lam Capital, the venture capital arm of Lam Research Corp. (NASDAQ:LRCX), a global provider of wafer fabrication equipment and services for the semiconductor industry. Participants also include UMC Capital, the venture capital arm of UMC Corp. (NYSE:UMC), and MediaTek Capital, the venture capital arm of MediaTek Inc. (TWSE: 2454.TW). Several leading financial and corporate investors also contributed to the oversubscribed round, alongside existing investors.

Multibeam will use the proceeds to accelerate development of its next-generation multi-column E-Beam Lithography (EBL) platform for 300mm wafer and panel-level maskless lithography. The funds will also be used to develop applications that enable silicon innovations to meet the lower-energy and higher-performance demands of artificial intelligence (AI) and related technologies, which require advanced packaging and integration of semiconductors, as well as rapid development and time-to-market of new chip technologies and designs. Multibeam's platform offers a powerful, production-grade tool that provides full-wafer (or panel-level) field of view, exceptional depth of focus (DoF), maskless writing, and the ability to write unique patterns. These capabilities ...